Semiconductor, Carbon Fiber, and Metalworking on GTI Technologies
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Usage/material. Grinding machine for semiconductorrelated materials including hard brittle materials such as sapphire substrates, SiC substrates, and ceramics, etc.
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'Grinding' definition can be found in the Plouse Precision Manufacturing glossary.
A process model of wafer thinning by ... If you need more information about A process model of wafer thinning by diamond grinding, ... Highquality InGaN MQW on low ...
Basic Wafer Definitions August 2003 ia Semiconductor, Inc. ... A lower quality wafer that has been used in manufacturing and then
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